Showing results: 241 - 255 of 269 items found.
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Smart I/O -
Imperious Technology Inc.
An I/O server is a software which controls and monitors one or more PLCs /RTU's using various communication protocols.Our I/O servers are built on highly optimized Windows 32bit platform. They are capable of handling very large scale SCADA systems with minimal impact on CPU usage, resulting in effective timing and usage of available hardware.Currently, we have Master and Slave solutions for DNP3 and Modbus (ASCII, RTU, TCP). Please select the appropriate tab above for more informaiton.If you are looking for a specific I/O Server, please contact us with your needs.
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AOI -
ficonTEC Service GmbH
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Data Patterns Pvt. Ltd.
Data Patterns has built high reliability Cable Harness Test Systems for large installations. These are primarily used in launch vehicle aircraft and missile level cable harness test validation. Installations with upto 20,000 lines test capability at a single location have been supplied by Data Patterns. Portable version capable handling of as small as 384 points have also been addressed.
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Compact SL -
SEICA SpA
This configuration offers a completely automated solution via an integrated, SMEMA-compatible conveyor system, allowing completely automatic board handling and easy integration into high volume production lines. Configurable as ICT, pre-functional, functional and combinational. The compact footprint and the compliance with WCM criteria, enable easy and successful integration both in-line and/or within an automated test island. Cost reduction and high throughput guaranteed.
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Wewon Environmental Chambers Co, Ltd.
Salt Spray Chamber used for testing the corrosive resistance of products whose the surface was treated with paint, electroplating, inorganic and organic film, anode handling, anti-rust oil, etc. Wall-mount spray system can be freely placed without occupying any effective test space.With imported quartz nozzle, it has the characteristics of smooth interior wall, accurate angle and no crystalline in long-time spraying. Distinctive spring door hinge design makes the chamber door easy to open and close. The inner and external shell of the chamber is made from PVC materials; Easy launder no leakage phenomenon
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3122 -
Metrel d.d.
The MI 3122 SMARTEC Z Line-Loop / RCD is designed specifically for live circuit testing. The instrument contains integrated characteristics of fuses and RCDs for the evaluation of test results. The online voltage monitoring system allows the operator to control what is happening on three simultaneous voltages in real-time. The bright red and green PASS / FAIL lights and help screens for each measurement make the handling of the instrument easy and clear. All the results can be quickly saved on the instrument and then downloaded via the optional A 1291 EuroLink PRO or A 1290 EuroLink PRO Plus software for evaluation and professional report generation after testing.
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MiniMax™ -
Genmark Automation
Genmark’s MiniMax™ Equipment Front End Module (EFEM) is a class 1 minienvironment system designed to maximize productivity of semiconductor processing equipment tools that require the highest level of automation.The MiniMax™ can be customized to meet the automation requirements of any semiconductor manufacturing tool application and specified with one of the Genmark’s sophisticated and precise wafer and reticle handling robots, including the full line of patented GPR single or dual arm robots, GREX robot series, single and dual wafer aligners, FOUP/FOSB openers, reticle libraries, as well as any other customer specified equipment.
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Mountz Inc.
The EZ-Glider inverted telescoping torque arms securely keep electric or pneumatic torque tools in perpendicular or a level alignment to help prevent side loading or cross threading occurring during the assembly process. Crafted with lightweight durable carbon fiber the torque arm collapses like a telescope. The torque arms are ideal for assembly lines like automotive, aerospace and appliance where space is a premium and operator safety is mandatory. The ergonomic design of the EZ-Glider torque arms reduces RMI (repetitive motion injury) and CTS (carpal tunnel syndrome). The effortless handling of the torque arm provides comfortable tool operation and increased production. The flexible telescoping arms provide manufacturers the ability to mount the arms to a wall, workbench, a standard rail system, aluminum extrusion or existing overhead system. The torque arms are maintenance free.
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TR-MARK III 250V -
Raytech AG
The TR-MARK III 250V is the successor of the famous TR-MARK III. Besides an extended test voltage up to 250V, it offers new features and increased accuracy to make it a perfect system. A color LCD with back lighting and touch screen increases handling and user comfort. Two USB interfaces make it easy to store measurements on external storage devices and transfer easily to a personal computer or download nameplate data of transformer to test.
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RegPerfect -
Teledyne Monitor Labs
Data management is vital to your company's bottom line and mission critical environmental compliance goals. Today's environmental professionals must learn to do more with less when faced with budget constraints, rising operating costs, and staff reductions. TML helps environmental professionals around the world meet these challenges by offering RegPerfect Software.The Teledyne Monitor Labs RegPerfect® software system is a state of the art Data Acquisition Handling and Reporting Sytem. RegPerfect® is the culmination of more than 40 years of experience in the data acquisition system business. The software is designed to comply with the data collection, quality assurance, and reporting requirements of federal and local regulatory agencies. Operating in real time, this rugged platform provides the visibility, connectivity and securityfor all of your environmental and operational needs related to the performance of your Continuous Emission Monitoring (CEM) System. For the most recent updates to the software, please visit the Product Status page.
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CSW Series -
AMETEK Programmable Power, Inc.
The CSW Series represents a new generation of AC/DC power sources that address the increasing demands on test equipment to perform additional functions at a lower cost. By combining a flexible AC/DC power source with a high performance power analyzer, the Compact CSW Series is capable of handling complex applications that have traditionally required multiple systems. The sleek integrated approach of the CSW avoids cable clutter that is commonly found in test systems. All connections are made internally and the need for digital multimeters, power harmonics analyzers, and current shunts or clamps is eliminated.
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TR-MARK III R 250V -
Raytech AG
The TR-MARK III R 250V is the successor of the famous TR-MARK III R. Besides an extended test voltage up to 250V, it offers new features and increased accuracy to make it a perfect system. A color LCD with back lighting and touch screen increases handling and user comfort. Two USB interfaces make it easy to store measurements on external storage devices and transfer easily to a personal computer or download nameplate data of xformer to test.
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Cohu, Inc.
For optical sensor test Cohu offers a variety of solutions being driven by requirements for tri-temp, parallelism and stimulus spacing. Customized optical stimulus units are integrated into Cohu’s test handling systems. For light detector test, we implement different types of light sources, such as infrared, ambient- and colored light. We offer different solutions for 3D image sensors combining emitter and receiver tests of LiDAR, Time of Flight and Structured Light devices.
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781060-01 -
NI
The PCI‑8531 is a high-speed CANopen interface for developing applications with the NI‑Industrial Communications for CANopen driver. CANopen is the application layer that sits on top of the CAN physical layer often used for industrial automation … applications. CANopen was designed for motion-oriented machine control networks, such as handling systems, but now it is used in a variety of products and applications, including medical equipment, off-road vehicles, maritime electronics, public transportation, and building automation. The PCI‑8531 can transmit or receive process data objects (PDOs) and service data objects (SDOs) according to CiA‑DS 301. It also features a batch SDO editor with EDS file integration and LSS services support for slave node configuration.
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EV Group
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
